Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Patent
1993-09-27
1994-06-07
Wojciechowicz, Edward W.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Including dielectric isolation means
257712, 257726, 257778, 257796, 257902, 437182, 437187, 437209, 437228, H01L 2348, H01L 2144
Patent
active
053192370
ABSTRACT:
A self-encapsulated power conductor component with improved heat transfer has a chip bearing at least one power transistor having at least one interdigitated electrode, provided with an air bridge, and a sink provided with at least one metal islet in relief. The air bridge is reinforced and the chip is brazed in reverse to the islet of the sink by its air bridge. Other islets brazed to the metallizations on the rim of the chip reinforce the mechanical fixing. The access to the electrodes is obtained by via holes and the second face of the substrate may receive non-integrable components. The device can be applied to power transistors and integrated circuits, notably on GaAs.
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IBM Technical Disclosure Bulletin, vol. 21, No. 11, Apr. 1979, E. Berndlmaier, "Dummy Pads For Reduced Thermal Resistance".
Thomson Composants Microondes
Wojciechowicz Edward W.
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