Power semiconductor assembly and the method and apparatus for as

Details Power semiconductor assembly and the method and apparatus for as Power semiconductor assembly and the method and apparatus for as

1977-04-21

1978-11-14

Tupman, W.

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29569R, 269258, B23Q 308

Patent

active

041252527

ABSTRACT:
A power semiconductor assembly in which two metallic heat sinks with inner planar surfaces clamp between these surfaces a housing of a power semiconductor therein at a set clamping pressure. The casing has planar surfaces against which the inner planar surfaces of the heat sinks are clamped. Three threaded rod assemblies are assembled in three sets of recesses on the heat sinks controlling the pressure applied to the semiconductor assembly. Each heat sink has three recesses communicating with outer surfaces thereof aligned axially with corresponding similar recesses of the other heat sink. The rod assemblies each have a pair of threaded rods joined coaxially by a molded element made of, for example, porcelain, or a resin epoxy such as "Araldite", or a mica-glass composition. Nuts are threaded on the two rods and a calibrated elastic washer on one rod hold the entire assembly at the desired clamping pressure. The power semiconductor assembly is assembled in a press in which the heat sinks with the semiconductor clamped therebetween are compressed to a given level and then the nuts of the rod assemblies tightened and the pressure of the press released so that the rod assemblies relax to the desired clamping pressure desired to be applied to the housing between the heat sinks.

REFERENCES:
patent: 1015171 (1912-01-01), Goble
patent: 3071368 (1963-01-01), Harding

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