Power semiconductor arrangement

Details Power semiconductor arrangement Power semiconductor arrangement

2011-03-22

2011-03-22

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Regenerative type switching device

With housing or external electrode

C257S706000, C257S718000, C257SE23106, C257SE23084, C257SE23051

Reexamination Certificate

active

07910952

ABSTRACT:
One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve the thermal cycling stability of the connection between a baseplate of the module and a circuit carrier connected thereto, recesses are provided in the baseplate. One aspect further relates to a power semiconductor module.

REFERENCES:
patent: 5602720 (1997-02-01), Natsuhara et al.
patent: 6261703 (2001-07-01), Sasaki et al.
patent: 6844621 (2005-01-01), Morozumi et al.
patent: 2004/0022029 (2004-02-01), Nagatomo et al.
patent: 2007/0147005 (2007-06-01), Harada et al.
patent: 19707514 (1998-08-01), None
patent: 0108219 (2001-02-01), None
patent: WO 2005091363 (2005-09-01), None

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