Power-saving thermal head

Details Power-saving thermal head Power-saving thermal head

2006-05-16

2006-05-16

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

Reexamination Certificate

active

07046265

ABSTRACT:
A thermal head of the present invention is provided with a thermal insulation layer formed on a radiative substrate, a plurality of heating resistors formed on a top face of the thermal insulation layer, a plurality of power suppliers connected to the heating resistors to form a heater on a part of the heating resistors, and a protection layer that covers surfaces of at least the heating resistors and the power suppliers, wherein the thermal insulation layer is formed by laminating an inorganic high thermal insulation layer including a complex oxide ceramic containing Si, transition metal, and oxygen or including complex nitride ceramic containing Si, transition metal, and nitrogen on an organic thermal insulation layer that contains polyimide resin.

REFERENCES:
patent: 4096510 (1978-06-01), Arai et al.
patent: 5444475 (1995-08-01), Mitani
patent: 5949465 (1999-09-01), Taniguchi et al.

Affiliated with

Also associated with

Rating

Power-saving thermal head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power-saving thermal head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power-saving thermal head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3628555