Power rectifier

Details Power rectifier Power rectifier

2001-01-04

2001-10-30

Nguyen, Matthew (Department: 2838)

Electric power conversion systems

Current conversion

With cooling means

C310S06800R

Reexamination Certificate

active

06310791

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a power rectifier, and more particularly to such a power rectifier, which has means to protect the chip unit against the radiation of fusion and to stop the resin from an overflow during its fabrication.
FIG. 1
shows a power rectifier according to the prior art. This structure of power rectifier comprises a heat dissipation base
1
′ adapted for fastening to a heat sink, a hexagonal gasket
2
′ soldered to the top side of the heat dissipation base
1
′ around a flat, circular top projection of the heat dissipation base
1
′, a chip unit
3
′, the chip unit
3
′ comprising a chip
31
′ and two molybdenum pads
32
′ respectively disposed at top and bottom sides of the chip
31
′, a conducting rod member
4
′ soldered to the top-sided molybdenum pad of the chip unit
3
′, the conducting rod member
4
′ having a shank
42
′, and a cover shell
5
′ soldered to the hexagonal gasket
2
′ and covered over the chip unit
3
′ and the conducting rod member
4
′ after the molding of a resin on the top of the heat dissipation base
1
′ and the chip unit
3
′. The cover shell
5
′ comprises a center tube
51
′, which receives the shank
42
′ of the conducting rod member
4
′. The top end of the shank
42
′ is extended out of the center tube
51
′ of the cover shell
5
′ and processed to form an end contact. After the hexagonal gasket
2
′ and the heat dissipation base
1
′ have been soldered together, the topmost edge of the heat dissipation base
1
′ is disposed in flush with the top side wall of the hexagonal gasket
2
′. It is difficult to hold the chip unit
3
′ on the smooth topmost edge of the heat dissipation base
1
′ when soldering the chip unit
3
′ to the heat dissipation base
1
′. When molding the resin on the heat dissipation base
1
′ and the chip unit
3
′, the molten resin may flow out of the heat dissipation base
1
′ over the hexagonal gasket
2
′, affecting further procedure of soldering the cover shell
5
′ to the hexagonal gasket
2
′. Before soldering the cover shell
5
′ to the hexagonal gasket
2
′, the overflow of the resin must be removed. Further, when soldering the cover shell
5
′ to the hexagonal gasket
2
′ the radiation of fusion may damages the chip
31
′ of the chip unit
3
′.
SUMMARY OF THE INVENTION
The present invention provides a power rectifier, which eliminates the aforesaid drawbacks. According to one aspect of the present invention, the hexagonal gasket has an upright contact flange disposed around the center through hole thereof and adapted to hold the chip unit in place when soldering the chip unit to the heat dissipation base. According to another aspect of the present invention, the upright contact flange prevents an overflow of the resin when molding the resin on the top of the heat dissipation base and the chip unit. According to still another aspect of the present invention, the upright contact flange is press-fitted into the bottom open side of the cover shell to protect the chip unit against the radiation of fusion when soldering the cover shell to the hexagonal gasket.


REFERENCES:
patent: 3739209 (1973-06-01), Drabik
patent: 3895247 (1975-07-01), Iwata et al.
patent: 4941069 (1990-07-01), Danenberg et al.
patent: 5742498 (1998-04-01), Taniguchi et al.

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