Power package lead frame

Details Power package lead frame Power package lead frame

1999-12-30

2001-09-04

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C257S675000, C257S796000, C361S723000, C174S016300

Reexamination Certificate

active

06285549

ABSTRACT:

TECHNICAL FIELD OF THE DEVICE
The present device relates to a power package lead frame, or more particularly to a power package lead frame with the reduction of material costs, while maintaining the conventional radiating effect.
BACKGROUND ART
FIG. 6
is a front view for showing the conventional structure of a lead frame and
FIG. 7
is a side view of FIG.
6
. There, a lead frame (
101
), a chip (
103
), and a mold (
105
) encasing part of the lead frame (
101
) and the chip (
103
), are shown.
With respect to the lead frame (
101
), a leg part (
101
a
) extends at one side of the mold (
105
) for installing the same to a printed circuit board (not shown), and a radiation plate (
101
b
) is provided at the other side of the mold in order to radiate the heat from the chip (
103
) to the outside.
Further, the center part of the radiation plate (
101
i
) is provided with a hole (
101
c
) for connecting to an external radiator (not shown).
In the power package lead frame constructed as above, the thickness (t) of the leg part(
101
a
) and the thickness (T) of the radiation plate (
101
b
) are made with different thickness at the time of manufacturing of the lead frame in order to maximize the radiation effect of the radiation plate (
101
b
). The thickness (T) of the radiation plate (
101
b
) is made thicker than the thickness (t) of the leg (
101
a
). In order to maximize the radiation effect for radiating the heat generated from the chip to the outside, a conventional lead frame was made by using expensive lead frames of different thickness, which was problematic in terms of an increase in manufacturing costs.
SUMMARY OF THE DEVICE
Accordingly, the present device is designed to solve the aforementioned problem, and the objective of the present device is to provide a power package lead frame with the reduction of material costs, while maintaining the effect of a radiation plate radiating the heat generated from the chip to the outside.
To accomplish this objective, the present device is a power package lead frame comprising a lead frame having a paddle part, a radiation plate and a leg part; a chip joined to the paddle part of said lead frame; and a mold encasing said chip and a part of the leg part and the paddle part of the lead frame, wherein the radiation plate of the lead frame comprises a first plate extending from the paddle part, having the same thickness as the paddle part and the leg part, and a second plate extending from the first plate, with the same thickness as the first plate, said second plate being folded towards the first plate, superposing tightly thereto, in such a manner that the radiation plate is twice as thick as the thickness of the paddle part or the leg part.


REFERENCES:
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4675718 (1987-06-01), Tsubokura et al.
patent: 5049973 (1991-09-01), Satriano et al.
patent: 5309027 (1994-05-01), Letterman, Jr.
patent: 5675182 (1997-10-01), Moscicki

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