Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1999-06-16
2000-10-31
Chaudhuri, Olik
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438106, H01L 2144, H01L 2148, H01L 2150
Patent
active
061401528
ABSTRACT:
A power module includes a semiconductor substrate and spaced power transistor circuits formed in the substrate, each having respective anode and cathode portions. A power module housing substantially encloses the substrate. Flexible cathode straps and flexible anode straps are connected to the respective anode and cathode portions and extend out of the power module housing spaced from each other. At least two anode straps and cathode straps fold over at least a portion of the power module housing to overlap each other and form phase straps. The remaining cathode and anode straps fold over at least a portion of the power module housing such that respective cathode and anode straps overlap each other, thereby lowering inductance and reducing voltage overshoots at turn off.
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Coronati John M.
Shekhawat Sampat S.
Tumpey John J.
Cao Phat X.
Chaudhuri Olik
Intersil Corporation
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