Power module with improved heat dissipation

Details Power module with improved heat dissipation Power module with improved heat dissipation

2006-05-02

2006-05-02

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S778000, C257S690000

Reexamination Certificate

active

07038310

ABSTRACT:
The invention provides a power module that is excellent in heat dissipation and suitable for the trend of miniaturization with high density, and provides also a method of manufacturing the same. The power module includes an insulating layer including an inorganic filler and a thermosetting resin composition, a lead formed on the surface of the insulating layer, and a semiconductor chip mounted on a insulating layer side of the lead, and a heat sink formed on the backside of the insulating layer. The semiconductor chip is mounted on the lead by flip-chip bonding and sealed in the insulating layer.

REFERENCES:
patent: 3922712 (1975-11-01), Stryker
patent: 5625226 (1997-04-01), Kinzer
patent: 5627107 (1997-05-01), Howard
patent: 5703399 (1997-12-01), Majumdar et al.
patent: 5781412 (1998-07-01), de Sorgo
patent: 5920117 (1999-07-01), Sono et al.
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6060150 (2000-05-01), Nakatani et al.
patent: 6255742 (2001-07-01), Inaba
patent: 6784541 (2004-08-01), Eguchi et al.
patent: 10 173097 (1998-06-01), None

Affiliated with

Also associated with

Rating

Power module with improved heat dissipation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power module with improved heat dissipation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power module with improved heat dissipation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3595815