Power module using IMS as heat spreader

Details Power module using IMS as heat spreader Power module using IMS as heat spreader

1994-11-18

1996-04-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 361719, H05K 720

Patent

active

055130720

ABSTRACT:
In the present invention, a heat spreader, circuit boards for power semiconductor elements, and a circuit board for a control circuit are fixed on a metal plate. The heat spreader is made of an IMS. The IMS has a metal base made of Cu or Cu clad plate, and a high heat radiating insulating layer made of a resin-based material, and the metal plate and the heat spreader are adhered by the high heat radiating insulation layer and electrically insulated from each other. Only a power semiconductor element is soldered onto the heat spreader. A wiring pattern for guiding each terminal of the power semiconductor element to the outside is formed on a power circuit board. A control circuit for controlling the power semiconductor element is formed on the circuit board for the control circuit.

REFERENCES:
patent: 4908738 (1990-03-01), Kobari
patent: 5118903 (1992-06-01), Schupp
patent: 5398160 (1995-03-01), Umeda
patent: 5408128 (1995-04-01), Furnival
patent: 5422515 (1995-06-01), Endo

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