Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-07-22
2008-07-22
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C257S712000, C257S713000
Reexamination Certificate
active
11607152
ABSTRACT:
A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.
REFERENCES:
patent: 5444295 (1995-08-01), Lake et al.
patent: 5561321 (1996-10-01), Hirano et al.
patent: 5869890 (1999-02-01), Nishiura et al.
patent: 5895974 (1999-04-01), Eytcheson et al.
patent: 5920119 (1999-07-01), Tamba et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6297549 (2001-10-01), Hiyoshi
patent: 6501172 (2002-12-01), Fukada et al.
patent: 6924985 (2005-08-01), Kawakita et al.
patent: 6958535 (2005-10-01), Hirano et al.
patent: 7035105 (2006-04-01), Yamaguchi
patent: 7099155 (2006-08-01), Kobayashi et al.
patent: 3931634 (1991-04-01), None
patent: 19540814 (1997-05-01), None
patent: 0631463 (1998-02-01), None
patent: 10-167804 (1998-06-01), None
German patent application No. 10-2006-058-347, examination report dated Feb. 27, 2008.
Fujimoto Takashi
Konagata Shoichi
Nagaishi Hiroto
Chervinsky Boris L
OMRON Corporation
Weaver Austin Villeneuve & Sampson LLP
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