Power module having self-contained cooling system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S699000, C361S700000, C361S715000, C165S080400, C165S080500, C165S104330, C165S185000

Reexamination Certificate

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07450378

ABSTRACT:
A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.

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patent: 7327570 (2008-02-01), Belady

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