Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-12-01
2009-11-03
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23051, C257SE23098, C257SE23105, C257SE23016, C257SE25030, C257S675000, C257S177000, C257S714000, C257S712000, C257S717000, C257S720000, C257S668000, C257S685000, C257S529000, C257S532000, C438S122000
Reexamination Certificate
active
07612448
ABSTRACT:
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.
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Tanaka Mitsuhiro
Teraki Junichi
Daikin Industries Ltd.
Global IP Counselors, LLP
Williams Alexander O
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