Power module having a cooling device and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257SE23051, C257SE23098, C257SE23105, C257SE23016, C257SE25030, C257S675000, C257S177000, C257S714000, C257S712000, C257S717000, C257S720000, C257S668000, C257S685000, C257S529000, C257S532000, C438S122000

Reexamination Certificate

active

07612448

ABSTRACT:
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.

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