Power module flip chip package

Details Power module flip chip package Power module flip chip package

2004-08-26

2009-02-17

Malsawma, Lex (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S738000, C257SE23026, C257SE23062

Reexamination Certificate

active

07492043

ABSTRACT:
A power module flip chip package is provided. The power module flip chip package includes a package carrier having a front surface and a back surface facing the front surface, and a power semiconductor device electrically connected to the front surface of the package carrier via conductive bumps. The conductive bumps are electrically connected to a gate terminal, a source terminal, and a drain terminal of the power semiconductor device. The power module flip chip package has reduced resistance and inductance and improved reliability.

REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 6442033 (2002-08-01), Liu et al.
patent: 6645791 (2003-11-01), Noquil et al.
patent: 6893901 (2005-05-01), Madrid
patent: 2004/0113281 (2004-06-01), Brandenburg et al.
patent: 2005/0040518 (2005-02-01), Brandenburg et al.
patent: 2005/0218509 (2005-10-01), Kipnis et al.

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