Power module fabrication method and structure thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S125000, C257S796000

Reexamination Certificate

active

07491583

ABSTRACT:
A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.

REFERENCES:
patent: 4736273 (1988-04-01), Vertongen et al.
patent: 4859631 (1989-08-01), Barre
patent: 5835352 (1998-11-01), Matsuzaki et al.
patent: 6177632 (2001-01-01), Ashdown
patent: 7309916 (2007-12-01), Kang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Power module fabrication method and structure thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power module fabrication method and structure thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power module fabrication method and structure thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4092708

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.