Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-03-09
2009-02-17
Dang, Trung (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S125000, C257S796000
Reexamination Certificate
active
07491583
ABSTRACT:
A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.
REFERENCES:
patent: 4736273 (1988-04-01), Vertongen et al.
patent: 4859631 (1989-08-01), Barre
patent: 5835352 (1998-11-01), Matsuzaki et al.
patent: 6177632 (2001-01-01), Ashdown
patent: 7309916 (2007-12-01), Kang et al.
Hsieh Yi Hwa
Kuo Chin Chi
Dang Trung
Delta Electronics , Inc.
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