Power module device

Details Power module device Power module device

1995-04-18

1997-03-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361796, 174252, H05K 500

Patent

active

056107994

ABSTRACT:
The power module device is equipped with a metallic substrate composed of a flat section and a recessed section, and a circuit board which is rested over the recessed section of the metallic substrate. The metallic substrate and the circuit board constitute a package. In the recessed section, the power element is mounted on the bottom surface section and the control element is mounted on the bottom surface of the circuit board. Then, the power element and the control element are electrically connected via a wiring pattern or the like provided on the metallic substrate.

REFERENCES:
patent: 5513072 (1996-04-01), Imaji et al.
patent: 5521437 (1996-05-01), Oshima et al.
patent: 5536972 (1996-07-01), Kato

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