Power module comprising at least two substrates and method...

Details Power module comprising at least two substrates and method... Power module comprising at least two substrates and method...

2007-02-13

2007-02-13

Tran, Thien F. (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C438S112000

Reexamination Certificate

active

10510455

ABSTRACT:
A power module and a method for producing it. The power module has a first substrate having power semiconductor chips, and a second substrate populated with signal semiconductor chips. The substrates are oriented parallel one above the other, their placement sides being arranged facing one another, and the second substrate, with the aid of bonding wires bent in hingelike fashion, being held at a defined distance d from the first substrate and being mechanically fixed in a plastic housing and electrically connected.

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