Power module circuit board and a process for the manufacture the

Details Power module circuit board and a process for the manufacture the Power module circuit board and a process for the manufacture the

1997-08-25

2000-01-11

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428910, 427 96, 361736, 361746, B32B 300

Patent

active

060133570

ABSTRACT:
A conductor pattern is formed on at least one surface of an AlN- or Si.sub.3 N.sub.4 -based ceramic substrate which is such that the ratio between the principal metal component binding with N to form the ceramic mass and the B in the BN remaining on the surface layer is no more than 50.times.10.sup.-6 as either B/Al or B/Si, wherein B/Al represents the ratio of I.sub.B to I.sub.Al where I.sub.B is the X-ray diffraction intensity of boron present on the surface layer and I.sub.Al is the X-ray diffraction intensity of aluminum, and B/Si represents the ratio of I.sub.B to I.sub.Si where I.sub.B is as defined above and I.sub.Si is the X-ray diffraction intensity of silicon. The thus produced circuit board has both a peel strength of at least 30 kg/mm.sup.2 and a capability of withstanding at least 30 heat cycles and, hence, satisfies the performance requirements of the recent models of power module ceramic circuit boards.

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