Power module board and power module using the board

Details Power module board and power module using the board Power module board and power module using the board

1999-06-29

2000-09-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361700, 361702, 361719, 361746, 361807, 361820, 257707, 257711, 257712, 174 163, H05K 720

Patent

active

061221708

ABSTRACT:
A ceramic base plate of aluminum nitride ceramics, for example, as a power module board has a metal layer on a surface of the ceramic base plate at a fixing portion at which the ceramic base plate is fixed onto a heat radiating plate. Further, a metal film is provided entirely on the rear surface of the ceramic base plate. An IGBT chip or the like is fixed onto the ceramic base plate with a conductive layer interposed therebetween, to form a power module board. Therefore, it is possible to avoid the generation of cracks when the ceramic base plate is mechanically fixed onto the heat radiating plate without using solder, and heat radiation from the ceramic base plate to the heat radiating plate can be improved.

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patent: 5949649 (1999-09-01), Bartlow
patent: 5956231 (1999-09-01), Yamada et al.

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