Power module and power module with heat sink

Details Power module and power module with heat sink Power module and power module with heat sink

2006-03-28

2006-03-28

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S708000, C361S699000, C428S545000, C257S703000, C257S706000

Reexamination Certificate

active

07019975

ABSTRACT:
The present invention relates to a power module in which an insulated circuit board is fixed to one main surface of a heat discharge plate. It is an object thereof to provide a power module in which the heat discharge characteristics are improved without any marked warping being generated, and that has an extended heat cycle longevity.In the power module10of the present invention, a square insulated circuit board12is fixed to one main surface of a heat discharge plate11. The heat discharge plate11is formed of an Al based alloy plate having a thickness A of 3 to 10 mm, and the insulated circuit board12having a side B of 30 mm or less in length is brazed directly onto the heat discharge plate11. It is-preferable that the brazing material used is one or two or more brazing materials selected from Al—Si, Al—Ge, Al—Cu, Al—Mg, and Al—Mn based brazing materials. It is also preferable that the insulated circuit board12is formed by a ceramic substrate12aand Al plates12band12cthat are bonded to both surfaces thereof, and that the Al plate12bhas a purity of 99.98 or greater percent by weight.

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U.S. Appl. No. 10/743,081.
A copy of International Search Report of PCT/JP01/06854 mailed on Nov. 13, 2001.

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