Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-10-01
2010-06-08
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257SE23080, C257SE29197
Reexamination Certificate
active
07732917
ABSTRACT:
A power module includes a substrate having first and second main substrate surfaces; a semiconductor device disposed on the first main substrate surface, and having a first main surface on which a first main electrode is formed, and a second main surface on which a second main electrode in contact with the first main substrate surface is formed; a heat conduction portion disposed on the first main substrate surface in a residual region of a region on which the semiconductor device is disposed; and an upper cooling portion disposed on the heat conduction portion.
REFERENCES:
patent: 7557442 (2009-07-01), Licht
patent: 2005-142228 (2005-06-01), None
Okumura Keiji
Otsuka Takukazu
Saito Masao
Fish & Richardson P.C.
Potter Roy K
Rohm & Co., Ltd.
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