Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-05-04
2002-07-16
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S783000, C361S790000, C361S742000, C361S735000, C361S784000, C361S785000
Reexamination Certificate
active
06421244
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a structure of a power module and, more particularly, to a structure of a power module including an insulative substrate on which power semiconductor devices (referred to hereinafter as “power devices”) are mounted and a control circuit substrate on which IC chips for controlling the power devices are mounted.
2. Description of the Background Art
FIG. 14
is a cross-sectional view of a structure of a background art power module. As illustrated in
FIG. 14
, the background art power module comprises an insulative substrate
104
, a control circuit substrate
112
, interconnection terminals, leads, or terminal members (although the term “terminals” are used hereinafter)
110
, and a case
109
. The insulative substrate
104
includes a ceramic plate
101
and metal plates
102
,
103
. A plurality of power devices
106
are mounted on the metal plate
102
with solder
105
. The plurality of power devices
106
are electrically connected to each other through aluminum wires
111
. The metal plate
103
is in contact with a base plate
108
, with solder
107
therebetween.
A plurality of semiconductor devices
113
for controlling the power devices
106
are mounted on the control circuit substrate
112
. An external connection terminal
137
electrically connected to the semiconductor devices
113
are soldered to the control circuit substrate
112
.
Each of the interconnection terminals
110
has a first end electrically connected to the metal plate
102
or the power devices
106
through the aluminum wires
111
, and a second end connected to the control circuit substrate
112
.
The insulative substrate
104
, the control circuit substrate
112
and the interconnection terminals
110
are disposed in the case
109
. A lower interior space of the case
109
below the control circuit substrate
112
is filled with silicone gel
114
. A cover
115
is mounted on top of the case
109
. Main electrodes
135
are provided on an upper surface of the case
109
and electrically connected to the power devices
106
through terminals
136
and aluminum wires.
FIG. 15
is an enlarged cross-sectional view of a connection between the second end of one of the interconnection terminals
110
and the control circuit substrate
112
. The control circuit substrate
112
has a through hole
118
around which is provided a terminal
116
electrically connected to the semiconductor devices
113
. The second end of the interconnection terminal
110
is inserted into the through hole
118
and mounted therein by solder
117
applied around the through hole
118
. This provides physical and electrical connections between the second end of the interconnection terminal
110
and the control circuit substrate
112
.
However, such a background art power module in which the second end of the interconnection terminal
110
and the control circuit substrate
112
are joined to each other by the solder
117
requires a large number of assembling steps, resulting in increased costs. Additionally, the background art power module is uneconomical since, if a failure occurs in only one of the control circuit substrate
112
and the insulative substrate
104
, both of the substrates
112
and
104
must be discarded.
SUMMARY OF THE INVENTION
According to a first aspect of the present invention, a power module comprises: a first substrate including a power device; a second substrate opposed to the first substrate and including a semiconductor device for controlling the power device; an interconnection terminal having a first end electrically connected to the first substrate, and a second end electrically connected to the second substrate; and a case having an interior space in which the first substrate, the second substrate and the interconnection terminal are disposed, wherein the second substrate further includes a connector electrically connected to the semiconductor device, and wherein the second end of the interconnection terminal is removably connected to the connector.
Preferably, according to a second aspect of the present invention, in the power module of the first aspect, the connector is disposed near an outer periphery of the second substrate.
Preferably, according to a third aspect of the present invention, in the power module of the first or second aspect, the connector is formed on a main surface of the second substrate which is on the same side as is the semiconductor device.
Preferably, according to a fourth aspect of the present invention, in the power module of any one of the first to third aspects, the connector is formed on a main surface of the second substrate which is opposed to the first substrate.
According to a fifth aspect of the present invention, a power module comprises: a first substrate including a power device; a second substrate opposed to the first substrate and including a semiconductor device for controlling the power device; an interconnection terminal having a first end electrically connected to the first substrate, and a second end electrically connected to the second substrate; and a case having an interior space in which the first substrate, the second substrate and the interconnection terminal are disposed, wherein the second end of the interconnection terminal has elasticity, and wherein the second substrate further includes a conductor pattern formed on a main surface of the second substrate which is opposed to the first substrate, the conductor pattern being electrically connected to the semiconductor device and contacting the second end of the interconnection terminal. The power module further comprises fastening means for removably fixing the case and the second substrate to each other, with the second end of the interconnection terminal displaced upon being pressed by the conductor pattern.
Preferably, according to a sixth aspect of the present invention, in the power module of the fifth aspect, the case includes a receiving surface for placing the second substrate thereon, and the fastening means includes: a first threaded hole formed in the receiving surface; a second threaded hole formed in the second substrate in a position corresponding to the first threaded hole; and a screw configured to be screwed into the first and second threaded holes.
According to a seventh aspect of the present invention, a power module comprises: a first substrate including a power device; a second substrate opposed to the first substrate and including a semiconductor device for controlling the power device; an interconnection terminal having a first end electrically connected to the first substrate, and a second end electrically connected to the second substrate; and a case having an interior space in which the first substrate, the second substrate and the interconnection terminal are disposed, wherein the second substrate further includes a through hole electrically connected to the semiconductor device, and wherein the second end of the interconnection terminal has elasticity in a widthwise direction thereof, and is removably fitted in the through hole.
Preferably, according to an eighth aspect of the present invention, in the power module of any one of the first to fourth and seventh aspects, the case includes a positioning structure for defining a mounting position of the second substrate in the case.
Preferably, according to a ninth aspect of the present invention, in the power module of any one of the first to eighth aspects, at least a connection between the second substrate and the interconnection terminal is sealed with resin.
In accordance with the first aspect of the present invention, the power module is provided in which the second substrate is easy to mount and remove since the second end of the interconnection terminal is removably connected to the connector.
In accordance with the second aspect of the present invention, the second substrate is easily mounted to the second end of the interconnection terminal. Additionally, the amount of flexure of the second substrate is reduced, wi
Shinohara Toshiaki
Yoshida Takanobu
Gandhi Jayprakash N.
Mitsubishi Denki & Kabushiki Kaisha
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Tran Thanh Y.
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