Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2004-06-04
2008-11-25
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257S099000, C257S675000, C257S719000, C257SE33058
Reexamination Certificate
active
07456499
ABSTRACT:
A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.
REFERENCES:
patent: 4267559 (1981-05-01), Johnson et al.
patent: 5173839 (1992-12-01), Metz, Jr.
patent: 5785418 (1998-07-01), Hochstein
patent: 5789772 (1998-08-01), Jiang
patent: 5841177 (1998-11-01), Komoto et al.
patent: 5869883 (1999-02-01), Mehringer et al.
patent: 5892278 (1999-04-01), Horita et al.
patent: 5959316 (1999-09-01), Lowery
patent: 5998925 (1999-12-01), Shimizu et al.
patent: 6238599 (2001-05-01), Gelorme et al.
patent: 6273596 (2001-08-01), Parkyn, Jr.
patent: 6274924 (2001-08-01), Carey et al.
patent: 6307272 (2001-10-01), Takahasi et al.
patent: 6329706 (2001-12-01), Nam
patent: 6335548 (2002-01-01), Roberts et al.
patent: RE37707 (2002-05-01), Bozzini et al.
patent: 6429513 (2002-08-01), Shermer, IV et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 6456766 (2002-09-01), Shaw et al.
patent: 6457645 (2002-10-01), Gardner, Jr.
patent: 6468821 (2002-10-01), Maeda et al.
patent: D465207 (2002-11-01), Williams et al.
patent: 6492725 (2002-12-01), Loh et al.
patent: 6541800 (2003-04-01), Barnett et al.
patent: 6559525 (2003-05-01), Huang
patent: 6610563 (2003-08-01), Waitl et al.
patent: 6680491 (2004-01-01), Nakanishi et al.
patent: 6707069 (2004-03-01), Song et al.
patent: 6924514 (2005-08-01), Suenaga
patent: 7264378 (2007-09-01), Loh
patent: 7280288 (2007-10-01), Loh et al.
patent: 2002/0113244 (2002-08-01), Barnett et al.
patent: 2003/0057573 (2003-03-01), Sekine et al.
patent: 2003/0168670 (2003-09-01), Roberts et al.
patent: 2003/0168720 (2003-09-01), Kamada
patent: 2003/0193080 (2003-10-01), Cabahug et al.
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0079957 (2004-04-01), Andrews et al.
patent: 2004/0173804 (2004-09-01), Yu
patent: 2005/0221519 (2005-10-01), Leung et al.
patent: 09-083018 (1997-03-01), None
patent: 2002103977 (2003-10-01), None
patent: 2003298117 (2003-10-01), None
United States Patent Application Entitled: Power surface mount light emitting die package U.S. Appl. No. 10/446,532 Inventor(s): Ban P. Loh filed May 27, 2003 Published date: Mar. 4, 2004.
United States Patent Application Entitled: Power surface mount light emitting die package U.S. Appl. No. 10/692,351 Inventor(s): Peter Scott Andrews, Ban P. Loh, Durham filed Oct. 22, 2003 Published date: Apr. 29, 2004.
United States Patent Application Entitled: Composite leadframe LED package and method of making the same U.S. Appl. No. 10/721,654 Inventor(s): Ban P. Loh filed Nov. 25, 2003 Published date: Jul. 1, 2004.
United States Patent Application Entitled: LED package die having a small footprint U.S. Appl. No. 10/721,641 Inventor(s): Ban P. Loh filed Nov. 25, 2003 Published date: Jul. 1, 2004.
United States Patent Application Entitled: Composite optical lens with an integrated reflector U.S. Appl. No. 10/861,639 Inventor(s): Ban P. Loh, Gerald H. Negley filed Jun. 4, 2004 Published date: Not yet published.
U.S. Provisional application entitled, “LED Package with a Long Stem Body as Heat-Spreader and a Small Footprint.” U.S. Appl. No. 60/431,501, filed Dec. 6, 2002.
U.S. Provisional application entitled, “Leadframe Based LED or Semiconductor Package with Improved Heat Spreading.” U.S. Appl. No. 60/431,523, filed Dec. 6, 2002.
U.S. Patent Application entitled, “LED Package Die Having a Small Footprint.” Inventor: Ban P. Loh. U.S. Appl. No. 10/721,641, filed Nov. 25, 2003.
U.S. Patent Application entitled, “Composite Leadframe LED Package and Method of Making the Same.” Inventor: Ban P. Loh. U.S. Appl. No. 10/721,654, filed Nov. 25, 2003.
International Search Report and Written Opinion dated Apr. 19, 2006.
EPO Communication dated Aug. 11, 2008 regarding intent to grant EPO patent.
Loh Ban P.
Negley Gerald H.
Cree Inc.
Ingham John C
Jenkins Wilson Taylor & Hunt, P.A.
Weiss Howard
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