Power inductor with heat dissipating structure

Details Power inductor with heat dissipating structure Power inductor with heat dissipating structure

2006-10-27

2008-09-30

Mai, Anh T (Department: 2832)

Inductor devices

With temperature modifier

Heat exchanging surfaces

C336S055000

Reexamination Certificate

active

07429907

ABSTRACT:
The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.

REFERENCES:
patent: 6075491 (2000-06-01), Dakeya et al.
patent: 6144282 (2000-11-01), Lee
patent: 6460244 (2002-10-01), Shafer et al.
patent: 6486763 (2002-11-01), Kummel
patent: 6621397 (2003-09-01), Hsu
patent: 6741154 (2004-05-01), Kawasaki et al.
patent: 2006/0157798 (2006-07-01), Hayashi et al.
patent: 2000-306751 (2000-02-01), None
patent: 2001-35731 (2001-09-01), None

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