Power inductor with heat dissipating structure

Details Power inductor with heat dissipating structure Power inductor with heat dissipating structure

2008-09-30

2008-09-30

Mai, Anh T (Department: 2832)

Inductor devices

With temperature modifier

Heat exchanging surfaces

C336S055000

Reexamination Certificate

active

11553936

ABSTRACT:
The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.

REFERENCES:
patent: 6075491 (2000-06-01), Dakeya et al.
patent: 6144282 (2000-11-01), Lee
patent: 6460244 (2002-10-01), Shafer et al.
patent: 6486763 (2002-11-01), Kummel
patent: 6621397 (2003-09-01), Hsu
patent: 6741154 (2004-05-01), Kawasaki et al.
patent: 2006/0157798 (2006-07-01), Hayashi et al.
patent: 2000-306751 (2000-02-01), None
patent: 2001-35731 (2001-09-01), None

Affiliated with

Also associated with

Rating

Power inductor with heat dissipating structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power inductor with heat dissipating structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power inductor with heat dissipating structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3942400