Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-11-01
2005-11-01
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S774000
Reexamination Certificate
active
06961247
ABSTRACT:
Disclosed are novel methods and apparatus for efficiently providing power buses and bump patterns with reduced inductance and/or resistance. In an embodiment, an apparatus is disclosed. The apparatus includes a plurality of power and ground bus pairs. Each power and ground bus pair may have a power bus and a ground bus. The apparatus further includes a first power bus from a first pair of the plurality of power and ground bus pairs. The first power bus may include a plurality of power bumps. The apparatus also includes a first ground bus from the first pair of the plurality of power and ground bus pairs. The first ground bus may include a plurality of ground bumps. Each of the plurality of power/ground bumps may be substantially equidistance from any immediately neighboring ground bump of the first ground bus.
REFERENCES:
patent: 6160298 (2000-12-01), Ohkubo
patent: 6305000 (2001-10-01), Phan et al.
patent: 6308307 (2001-10-01), Cano et al.
patent: 6410990 (2002-06-01), Taylor et al.
patent: 6483714 (2002-11-01), Kabumoto et al.
Schmidt Steven A.
Tomsio Nayon
Whitney Linda S.
Blakely , Sokoloff, Taylor & Zafman LLP
Cuneo Kamand
Dinh Tuan
Sun Microsystems Inc.
LandOfFree
Power grid and bump pattern with reduced inductance and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power grid and bump pattern with reduced inductance and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power grid and bump pattern with reduced inductance and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3471218