Power electronic module cooling system and method

Details Power electronic module cooling system and method Power electronic module cooling system and method

2008-04-25

2009-11-10

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S695000, C174S016100, C174S016300, C165S080300

Reexamination Certificate

active

07616442

ABSTRACT:
An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided wherein an air directing structure with a finite air-flow resistance is deployed in a cooling channel adjacent to a heatsink in a first cooling zone, such that some portion of the cooling air is forced through the heatsink while the rest of the cooling air bypasses the heatsink to provide additional cooling air to a second cooling zone. Additionally, the air-flow resistance of the air directing structure can be chosen so that the fan operates at its optimal point (maximum power input to the air).

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patent: 6665183 (2003-12-01), Shikata et al.
patent: 6891725 (2005-05-01), Derksen
patent: 7027300 (2006-04-01), Lord
patent: 7054157 (2006-05-01), Hirota et al.
patent: 2002/0036889 (2002-03-01), Ruiz-Gomez et al.

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