Power electronic module and power electronic device including su

Details Power electronic module and power electronic device including su Power electronic module and power electronic device including su

1998-06-19

2000-07-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361701, 361688, 361689, 361704, 361707, 361715, 361716, 361721, 174 151, 165 804, 165185, H05K 720

Patent

active

060847719

ABSTRACT:
The invention concerns a power electronic module comprising two individual modules (1) each comprising a power electronic component (5) having a contact face (6) mounted on a metallic face (7) of a substrate (8), power connections (11, 13, 20) a metallic heat exchanger (2) mounted on the other face (12) of the substrate (8).
In accordance with the invention the two individual modules (1) are face to face, the power electronic component (5) of one individual module (1) facing the power electronic component (5) of the other individual module (1), and separated from each other by at least one spacer (3) comprising control leads (14) for controlling the individual modules (1) and power leads (13) for transmitting power to the individual modules (1) or between individual modules (1).

REFERENCES:
patent: 4716498 (1987-12-01), Ellis
patent: 4878106 (1989-10-01), Sachs
patent: 4916575 (1990-04-01), Van Asten
patent: 5181167 (1993-01-01), Davidson et al.
patent: 5424919 (1995-06-01), Hielbronner
patent: 5608610 (1997-03-01), Brzezinski
Patent Abstracts of Japan. vol. 018. No. 531 (E-1614), Oct. 7, 1994 corresponding to JP 06 188363 A (Mitsubishi Electric Corp) dated Jul. 8, 1994.
Patent Abstracts of Japan, vol. 018. No. 556 (E-1620), Oct. 24, 1994 corresponding to JP 06 204398 A (NEC Corp) dated Jul. 22, 1994.

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