Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2011-04-19
2011-04-19
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S698000, C257S774000, C257SE21505, C257SE23109, C438S152000, C438S622000
Reexamination Certificate
active
07928553
ABSTRACT:
An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically conductive layer is applied over the electrically insulating substrate. A first semiconductor chip is placed over the first electrically conductive layer. The first semiconductor chip comprises a first electrode on a first main surface and a second electrode on a second main surface. An electrically insulating layer is applied over the first electrically conductive layer. A second electrically conductive layer is applied over the electrically insulating layer. A through connection is provided in the electrically insulating layer to couple the first electrically conductive layer to the second electrically conductive layer.
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Haeberlen Oliver
Otremba Ralf
Schiess Klaus
Chambliss Alonzo
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
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