Power distribution system for semiconductor die

Details Power distribution system for semiconductor die Power distribution system for semiconductor die

1997-06-25

2000-02-15

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular power supply distribution means

257691, 257700, 257211, 257208, 257393, 257903, H01L 2976, H01L 2994, H01L 31062, H01L 31113

Patent

active

060256168

ABSTRACT:
A power distribution system for a semiconductor die includes bonding pads located adjacent to and connected to power busses with connections between the bonding pads providing a parallel path for current. Connections may be provided by stitch bonds, by conductors within a substrate or by other means.

REFERENCES:
patent: 4701778 (1987-10-01), Aneha et al.
patent: 4862322 (1989-08-01), Rickford et al.
patent: 5111271 (1992-05-01), Hatada et al.
patent: 5227232 (1993-07-01), Lim
patent: 5229639 (1993-07-01), Hansen et al.
patent: 5231305 (1993-07-01), Russell
patent: 5300798 (1994-04-01), Yamazaki et al.
patent: 5311048 (1994-05-01), Takahashi et al.
patent: 5384487 (1995-01-01), Rostoker et al.
patent: 5391920 (1995-02-01), Tsuji
patent: 5616954 (1997-04-01), Tobase
patent: 5625225 (1997-04-01), Huang et al.
patent: 5629559 (1997-05-01), Miyahara
patent: 5668389 (1997-09-01), Jassowski et al.
patent: 5670802 (1997-09-01), Koike
patent: 5672911 (1997-09-01), Patil et al.
patent: 5744870 (1998-04-01), Casper
patent: 5789791 (1998-08-01), Bergemont
patent: 5789807 (1998-08-01), Correale, Jr.
patent: 5831315 (1998-11-01), Kengeri et al.
Patent Abstracts of Japan, vol. 014, No. 273 (E-0940), Jun. 13, 1990 and JP 02 086131 A (Seiko Epson Corp), Mar. 27, 1990.
Patent Abstracts of Japan, vol. 012, No. 030 (E-578), Jan. 28, 1988 and JP 62 188261 A (Sony Corp), Aug. 17, 1987.
Patent Abstracts of Japan, vol. 007, No. 170 (E-189), Jul. 27, 1983 and JP 58 078439 A (Nippon Denki KK), May 12, 1983.
Patent Abstracts of Japan, vol. 015, No. 046 (E-1029) Feb. 4, 1991, and JP 02 278849 A (Fujitsu Ltd), Nov. 15, 1990.

Affiliated with

Also associated with

Rating

Power distribution system for semiconductor die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power distribution system for semiconductor die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power distribution system for semiconductor die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1907830