Power distribution lid for IC package

Details Power distribution lid for IC package Power distribution lid for IC package

1994-06-03

1995-12-12

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 3613062, 361707, 361761, H05K 720

Patent

active

054755654

ABSTRACT:
An electronic package for an integrated circuit. The integrated circuit is mounted to a heat spreader that is attached to a substrate. The heat spreader is thermally conductive and lowers the thermal impedance of the package. The heat spreader may also provide a return current path from the integrated circuit to the substrate. The substrate has internal power and signal lines that are coupled to the integrated circuit. The power and signal lines are connected to surface pads or leads that can be mounted to an external printed circuit board. Mounted to an inner area of the integrated circuit is a decoupling capacitor. The decoupling capacitor is also connected to a lid that is mounted to the substrate. The decoupling capacitor reduces the noise within the integrated circuit and is used to control the impedance of the overall package. The lid contains both power and ground planes that are connected to the capacitor and the power/ground pins of the substrate.

REFERENCES:
patent: 3880493 (1975-04-01), Lockhart, Jr.
patent: 4249196 (1981-02-01), Durney
patent: 4654694 (1987-03-01), Val
patent: 4739448 (1988-04-01), Rowe
patent: 4982311 (1991-01-01), Dehaine
patent: 5095402 (1992-03-01), Hernandez
patent: 5212402 (1993-05-01), Higgins, III
patent: 5272590 (1993-12-01), Hernandez

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