Power diode terminal holder mounting arrangement

Electrical connectors – With provision to dissipate – remove – or block the flow of heat – Distinct heat sink

Reexamination Certificate

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Details

C174S016300, C361S711000

Reexamination Certificate

active

06254423

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to power diodes and, more specifically, to a power diode terminal holder mounting arrangement, which is easy to install.
FIG. 1
shows a power diode terminal holder mounting arrangement according to the prior art design, two chips
2
′ are respectively soldered to a heat sink
1
′, the chips
2
′ each having two molybdenum pads
4
′ respectively soldered thereto at the top and bottom sides, and a copper plate
3
′ is soldered to the top-sided molybdenum pads
4
′ of the chips
2
′ to hold a terminal holder
5
′. The copper plate
3
′ has a recessed top sidewall. This design is not suitable for a high power diode.
FIG. 2
shows another power diode terminal holder mounting arrangement, in which the copper plate
3
″ has a flat top sidewall fitting the flat bottom edge of the terminal holder
5
′. Because the flat top sidewall of the copper plate
3
″ is a solid face, gas cannot be exhausted from the center of the soldering area between the copper plate
3
″ and the terminal holder
5
′, and air bubbles may exist in between the copper plate
3
″ and the terminal holder
5
′ after the soldering procedure. In this case, the terminal holder tends to be forced away from the copper plate
3
″, and the performance of the terminal holder
5
′ in heat and electricity conductivity is poor.
SUMMARY OF THE INVENTION
The present invention has been accomplished to provide a power diode terminal holder mounting arrangement, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide a copper plate for a power diode terminal holder mounting arrangement, which fits any of a variety of terminal holders. It is another object of the present invention to provide a power diode terminal holder mounting arrangement, which holds the terminal holder positively in position during the soldering procedure. According to the present invention, a ceramic plate is soldered to the chips and suspended below the bottom sidewall of the copper plate, and the copper plate has a flat base and a circular hole through the flat base for receiving any of a variety of terminal holders. After insertion of the selected terminal holder into the circular hole of the copper plate, the ceramic plate supports the terminal holder in position, and then the ceramic plate is soldered to the periphery of the circular hole of the copper plate.


REFERENCES:
patent: 5602720 (1997-02-01), Natsuhara et al.
patent: 6021045 (2000-02-01), Johnson
patent: B1 4521827 (1988-04-01), Jordan et al.
patent: 54-139558-A (1979-10-01), None
patent: 62-013106-A (1987-01-01), None

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