Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-01-04
2002-03-19
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C257S713000, C257S724000, C439S487000
Reexamination Certificate
active
06359785
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to power diodes and, more specifically, to a power diode and heat sink arrangement, which improves the performance of heat dissipation and, protects the chips against deformation and displacement during its installation.
FIG. 1
shows the arrangement of a power diode and heat sink for use in an electronic apparatus of high power output. This structure of power diode and heat sink arrangement comprises a heat sink
1
′, and two power diodes
2
′ installed in the heat sink
1
′. The power diodes
2
′ each comprises two chips
21
′ respectively soldered to the heat sink
1
′ each chip
21
′ having two molybdenum pads
23
′ respectively soldered to top and bottom sides thereof, a copper plate
22
′ connected between the chips
21
′ at the top side and soldered to the top-sided molybdenum pads
23
′ of the chips
21
′, a terminal holder
24
′ fastened to the copper plate
22
′ at the top side, and a copper screw
25
′ fastened to the terminal holder
24
′ to secure an electric wire. Because the copper plate
22
′ is suspended above the heat sink
1
′, the forward stress and side torsional force are directly transmitted to the copper plate
24
′ and the chips
21
′ when fastening up the copper screw
25
′, thereby causing the copper plate
22
′ to deform and the chips
21
′ to displace easily.
SUMMARY OF THE INVENTION
The present invention has been accomplished to provide a power diode and heat sink arrangement, which eliminates the aforesaid problems. It is one object of the present invention to provide a power diode and heat sink arrangement, which achieves a high performance in heat dissipation. It is another object of the present invention to provide a power diode and heat sink arrangement, which protects the copper plate and the chips against deformation and displacement. According to the present invention, a ceramic pad is connected between the heat sink and the copper plate of each power diode and spaced between the chips of the respective power diode and adapted to support the copper plate against deformation and to transmit heat from the copper plate to the heat sink for quick dissipation.
REFERENCES:
patent: 5373105 (1994-12-01), Nagaune et al.
patent: 5912804 (1999-06-01), Lawson et al.
patent: 6254423 (2001-07-01), Lin
Tolin Gerald
Troxell Law Office PLLC
LandOfFree
Power diode and heat sink arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power diode and heat sink arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power diode and heat sink arrangement will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2826973