Power device package having enhanced heat dissipation

Details Power device package having enhanced heat dissipation Power device package having enhanced heat dissipation

2011-04-19

2011-04-19

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679540, C361S708000, C361S719000, C165S080300, C174S016300, C174S252000, C257S002000, C257S004000, C257SE49001, C257SE49002, C257S310000, C257S192000

Reexamination Certificate

active

07929308

ABSTRACT:
A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.

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