Power device package and method of fabricating the same

Details Power device package and method of fabricating the same Power device package and method of fabricating the same

2008-08-20

2010-12-07

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S676000, C257S706000, C257S723000, C257SE23031, C257SE23141, C438S121000, C438S122000

Reexamination Certificate

active

07846779

ABSTRACT:
Provided are a power device package, which can be made compact by mounting semiconductor chips in recesses formed in a substrate and improve operational reliability by rapidly dissipating heat generated during operation to the outside, and a method of fabricating the power device package. The power device package includes: a substrate having a first surface and a second surface opposite to each other, and one or more recesses formed in the first surface; a wiring pattern formed on the first surface of the substrate; one or more power semiconductor chips placed in the recesses and electrically connected to the wiring pattern; a lead frame electrically connected to the wiring pattern; one or more control semiconductor chips electrically connected to the power semiconductor chips to control the power semiconductor chips; and an optional sealing member sealing the substrate, the wiring pattern, the power semiconductor chips, the control semiconductor chips, and at least a part of the lead frame so as to expose the second surface of the substrate.

REFERENCES:
patent: 6181008 (2001-01-01), Avery et al.
patent: 6313598 (2001-11-01), Tamba et al.
patent: 6703703 (2004-03-01), Grant
patent: 7061080 (2006-06-01), Jeun et al.
patent: 7176579 (2007-02-01), Konishi et al.
patent: 7529093 (2009-05-01), Sakamoto
patent: 2004/0070060 (2004-04-01), Mamitsu et al.
patent: 2005/0167789 (2005-08-01), Zhuang

Affiliated with

Also associated with

Rating

Power device package and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power device package and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power device package and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4196283