Power device having connection structure compensating for...

Amplifiers – With semiconductor amplifying device – Including plural amplifier channels

Reexamination Certificate

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C330S12400D

Reexamination Certificate

active

07429894

ABSTRACT:
Provided is a power device having a connection structure compensating for a reactance component, in which transistors are arranged and connected to minimize deterioration of transistor properties caused by heat by compensating for a reactance component causing a phase difference due to transmission lines used for connecting a plurality of transistors in parallel such that the power device to be used for a high-frequency power amplifier outputs high power, and transmitting heat generated by high output power to a heat sink to be dissipated.

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patent: 6650180 (2003-11-01), Lautzenhiser et al.
patent: 6747517 (2004-06-01), Lautzenhiser et al.
patent: 6771123 (2004-08-01), Pearce
patent: 6965128 (2005-11-01), Holm et al.
patent: 05-206763 (1993-08-01), None
patent: 2004-193039 (2004-07-01), None
patent: 10-0283520 (2000-12-01), None
patent: 10-0381685 (2003-04-01), None

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