Amplifiers – With semiconductor amplifying device – Including plural amplifier channels
Reexamination Certificate
2006-09-12
2008-09-30
Choe, Henry K (Department: 2817)
Amplifiers
With semiconductor amplifying device
Including plural amplifier channels
C330S12400D
Reexamination Certificate
active
07429894
ABSTRACT:
Provided is a power device having a connection structure compensating for a reactance component, in which transistors are arranged and connected to minimize deterioration of transistor properties caused by heat by compensating for a reactance component causing a phase difference due to transmission lines used for connecting a plurality of transistors in parallel such that the power device to be used for a high-frequency power amplifier outputs high power, and transmitting heat generated by high output power to a heat sink to be dissipated.
REFERENCES:
patent: 4733195 (1988-03-01), Tserng et al.
patent: 5106778 (1992-04-01), Hollis et al.
patent: 5519358 (1996-05-01), Tserng
patent: 5767755 (1998-06-01), Kim et al.
patent: 6005442 (1999-12-01), Maeda et al.
patent: 6650180 (2003-11-01), Lautzenhiser et al.
patent: 6747517 (2004-06-01), Lautzenhiser et al.
patent: 6771123 (2004-08-01), Pearce
patent: 6965128 (2005-11-01), Holm et al.
patent: 05-206763 (1993-08-01), None
patent: 2004-193039 (2004-07-01), None
patent: 10-0283520 (2000-12-01), None
patent: 10-0381685 (2003-04-01), None
Ahn Ho Kyun
Chang Woo Jin
Ji Hong Gu
Kim Hae-cheon
Lim Jong Won
Choe Henry K
Electronics and Telecommunications Research Institute
Ladas & Parry LLP
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