Power device assembly and method

Details Power device assembly and method Power device assembly and method

1991-12-23

1993-02-02

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29840, 174 163, 361386, 361388, 361399, 361413, 361383, 257712, H05K 720

Patent

active

051842831

ABSTRACT:
A power device assembly comprises a circuit board sub-assembly and a protective housing enclosing the circuit board sub-assembly. The circuit board sub-assembly includes a heat sink frame around the periphery of a circuit board. Heat generating power devices and, optionally, other circuit devices are mounted in thermally conductive contact with the heat sink frame. Electrical leads extend from the power devices to the circuit board where a solder connection is formed. The heat sink frame extends outwardly beyond the circuit board, at least a portion extending outwardly from the protective housing to provide cooling means for the assembly. According to a method of the invention, a sub-assembly comprising the circuit board, heat sink frame and power device is assembled and the heat sink frame is used as a palette to support and carry the circuit board through a wave soldering process.

REFERENCES:
patent: 4118756 (1978-10-01), Nelson et al.
patent: 4342068 (1982-07-01), Kling
patent: 4344267 (1982-08-01), Corman et al.
patent: 4720742 (1988-01-01), Egawa et al.
patent: 4725920 (1988-02-01), Ijichi et al.

Affiliated with

Also associated with

Rating

Power device assembly and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power device assembly and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power device assembly and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-10674