Power delivery using an integrated heat spreader

Details Power delivery using an integrated heat spreader Power delivery using an integrated heat spreader

2007-10-23

2007-10-23

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S125000

Reexamination Certificate

active

11215560

ABSTRACT:
An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

REFERENCES:
patent: 6558181 (2003-05-01), Chung et al.
patent: 6607942 (2003-08-01), Tsao et al.
patent: 7068515 (2006-06-01), Harris et al.

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