Power delivery using an integrated heat spreader

Details Power delivery using an integrated heat spreader Power delivery using an integrated heat spreader

2006-01-17

2006-01-17

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S706000, C257S712000, C257S713000, C257S720000, C361S704000, C361S707000

Reexamination Certificate

active

06987317

ABSTRACT:
An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.

REFERENCES:
patent: 5535816 (1996-07-01), Ishida
patent: 6195256 (2001-02-01), Tiziani et al.
patent: 6552267 (2003-04-01), Tsao et al.
patent: 6563709 (2003-05-01), Negishi et al.
patent: 6896039 (2005-05-01), Dussinger et al.
patent: 6903929 (2005-06-01), Prasher et al.
patent: 2004/0262766 (2004-12-01), Houle

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