Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-08-30
2005-08-30
Thompson, Craig A. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C361S306200
Reexamination Certificate
active
06936917
ABSTRACT:
A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
REFERENCES:
patent: 4734819 (1988-03-01), Hernandez et al.
patent: 4754366 (1988-06-01), Hernandez
patent: 4853826 (1989-08-01), Hernandez
patent: 5022869 (1991-06-01), Walker
patent: 5103283 (1992-04-01), Hite
patent: 5161729 (1992-11-01), Dunaway et al.
patent: 5212402 (1993-05-01), Higgins, III
patent: 5272590 (1993-12-01), Hernandez
patent: 5403195 (1995-04-01), Thrush et al.
patent: 5483099 (1996-01-01), Natarajan et al.
patent: 5734555 (1998-03-01), McMahon
patent: 5798567 (1998-08-01), Kelly et al.
patent: 5831810 (1998-11-01), Bird et al.
patent: 5844419 (1998-12-01), Akram et al.
patent: 5895966 (1999-04-01), Penchuk
patent: 6046911 (2000-04-01), Dranchak et al.
patent: 6222260 (2001-04-01), Liang et al.
patent: 6342724 (2002-01-01), Wark et al.
patent: 6489686 (2002-12-01), Farooq et al.
patent: 6558181 (2003-05-01), Chung et al.
patent: 2003/0193791 (2003-10-01), Panella et al.
patent: 2003/0194832 (2003-10-01), Lopata et al.
patent: 2003/0197198 (2003-10-01), Panella et al.
patent: 2003/0198033 (2003-10-01), Panella et al.
patent: WO 01/65344 (2001-09-01), None
International Search Report in PCT Counterpart Application No. PCT/US02/30589, Mar. 18, 2003.
Dutta Arindum
Lopata John E.
McGrath James L.
Panella Augusto P.
Molex Incorporated
Paulius Thomas D.
Thompson Craig A.
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