Power conversion system having multi-chip packages

Details Power conversion system having multi-chip packages Power conversion system having multi-chip packages

1999-07-12

2000-08-08

Wong, Peter S.

Electric power conversion systems

Current conversion

Using semiconductor-type converter

363 98, 363141, H02M 75387, H02M 768

Patent

active

061011142

ABSTRACT:
A power conversion system that is capable of achieving low inductance, improving cooling performance and making the external shape of the entire system small, is achieved by combining a plurality of single phase inverter units. The inverter units include four device packages each of which is composed of four packaged power devices, two neutral point clamp diodes, two by-pass diode packages and clamp diode packages. Each by-pass diode packages is composed of two packaged by-pass diodes. The clamp diode packages are composed of packaged clamp diodes. The by-pass diode packages are provided on one of the wall surfaces of the clamp diode package, and the device packages are provided on an outside wall surface of the by-pass diode package.

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