Power connector/decoupler integrated in a heat sink

Details Power connector/decoupler integrated in a heat sink Power connector/decoupler integrated in a heat sink

2011-03-01

2011-03-01

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C438S123000

Reexamination Certificate

active

07898078

ABSTRACT:
Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips. The two sets of conductor fins are electrically isolated from each other, and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of conductor fins to supply electrical power and electrical grounding to the stacked semiconductor chips. The bottommost surface of the stacked semiconductor chips may be bonded to a packaging substrate. Since the semiconductor fins above provide electrical power supply and electrical grounding, a higher fraction of electrical connections between the bottommost surface of the stacked semiconductor chips and the packaging substrate may be employed for input and output signal transmission without adverse impact on heat dissipation of the stacked semiconductor chips. The conductive fins function as power connectors. Decoupling capacitors including the conductive fins and dielectric portions therebetween may be formed.

REFERENCES:
patent: 3551758 (1970-12-01), Ferree
patent: 5014159 (1991-05-01), Butt
patent: 5212625 (1993-05-01), van Andel et al.
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 6860004 (2005-03-01), Hirano et al.
patent: 7059042 (2006-06-01), Hirano et al.
patent: WO2004079792 (2004-09-01), None

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