Power connection structure

Details Power connection structure Power connection structure

2002-04-12

2003-11-11

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S736000, C361S792000, C361S793000, C361S794000, C361S795000, C361S760000, C361S761000, C174S255000

Reexamination Certificate

active

06646886

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to printed circuit boards. More particularly, the present invention relates to a power connection structure for printed circuit boards.
BACKGROUND OF THE INVENTION
DC modules connected to printed circuit boards (PCB) have increasingly required higher current outputs. The connection from the PCB to the output pins can fail to provide an adequate path for the total current to transfer to the PCB without damaging it at the point of connection. Increasing the copper connections from these output pins to the PCB will solve the need for an increased current path. But at the same time, the additional copper inhibits the flow of solder due to the heat wicking effect of the increased copper area during the assembly process which will cause the upper layers of the PCB to have no connection at all to the output pins of the module.
FIG. 1
illustrates a PCB
100
having a power connection structure receiving a pin of a power supply module (not shown) according to a prior art. The PCB
100
has a top layer
102
, several intermediate layers
104
, and a bottom layer
106
.
FIG. 1
illustrates a PCB having four intermediate layers. A plated through hole
108
disposed through all layers
102
,
104
, and
106
mate with the pin of the power supply module.
FIG. 2
illustrates a cross-sectional view of a PCB
200
receiving a pin
202
of a power supply module
204
according to a prior art. A plated through hole
206
received the pin
202
. Solder
208
connects the pin
202
to the plating
210
of the plated through hole
206
. The pin
202
is coupled to the PCB
200
through solder
208
and the plating
210
. However during reflow process, the thermal mass from all the inner layers
212
draws heat from solder
208
and prevents solder
208
from reaching the top layer
214
of the PCB
200
.
Therefore, a solder fill may at most reach the second or third layer, rendering the connection inefficient and potentially faulty. It would be desirable to provide a power connection structure for a PCB capable of carrying high current outputs while preventing a heat wicking effect of the copper area due to high current, thereby saving costs and board space.
BRIEF DESCRIPTION OF THE INVENTION
A multi-layer printed circuit board (PCB) has a plated through hole for receiving a pin of a component. The plated through hole passes through all layers of the PCB and includes a first conductive portion on a first surface of the PCB and a second conductive portion on a second surface of the PCB. At least one layer of the PCB includes a planar conductive material disposed over a planar insulating material. The conductive material surrounds the plated through hole and is separated therefrom by a gap.


REFERENCES:
patent: 3566005 (1971-02-01), Shaheen
patent: 3660726 (1972-05-01), Ammon et al.
patent: 5363280 (1994-11-01), Chobot et al.
patent: 5381306 (1995-01-01), Schumacher et al.
patent: 6073344 (2000-06-01), Japp et al.

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