Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2006-01-19
2010-06-15
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S692000, C257S781000, C257S786000, C257SE23020
Reexamination Certificate
active
07737564
ABSTRACT:
A method for electrically coupling a bond pad of an integrated circuit such as a field programmable device, an application-specific integrated circuit, or a rapid chip with an input/output device is disclosed. The bond pad is provided with a plurality of metal layers configurable for making a connection with the input/output device. The bond pad is then coupled to the input/output device with an interconnect structure. The method for electrically coupling the bond pad to the input/output device allows the customer to configure the power and ground pad counts after the slice is created.
REFERENCES:
patent: 5089881 (1992-02-01), Panicker
patent: 5172471 (1992-12-01), Huang
patent: 5796170 (1998-08-01), Marcantonio
patent: 6031258 (2000-02-01), Ranjan et al.
patent: 6410990 (2002-06-01), Taylor et al.
patent: 6593649 (2003-07-01), Lin et al.
patent: 6727597 (2004-04-01), Taylor et al.
patent: 6770963 (2004-08-01), Wu
patent: 6825108 (2004-11-01), Khan et al.
patent: 6989593 (2006-01-01), Khan et al.
patent: 7129574 (2006-10-01), Wu
patent: 2001/0013663 (2001-08-01), Taylor et al.
patent: 2002/0043712 (2002-04-01), Efland
patent: 2004/0238939 (2004-12-01), Wu
patent: 2006/0151851 (2006-07-01), Pillai et al.
Ali Anwar
Doddapaneni Kalyan
Lau Tauman T.
Le Dung A.
LSI Corporation
Suiter Swantz pc llo
LandOfFree
Power configuration method for structured ASICs does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power configuration method for structured ASICs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power configuration method for structured ASICs will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4194849