Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate
2000-02-24
2003-05-27
Chaudhuri, Olik (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With housing mount
C257S731000, C257S734000, C257S704000, C257S706000
Reexamination Certificate
active
06570250
ABSTRACT:
FIELD OF THE INVENTION
The field of the invention is integrated circuit packaging.
BACKGROUND OF THE INVENTION
As the amount of power required by ICs increases, there is increasing difficulty in passing sufficient power through interconnects to the ICs. To make the issue worse, as the IC power has risen, the voltages have dropped from 5 V to 3.3 V, then to 1.2 V, and now approach 1V. This increase in power and decrease in voltage has caused the current required to increase rapidly. At the same time the number of I/O's and the switching rates are increasing while the I/O pitch on the chip is decreasing. All of this causes high dI/dt power noise which make clean power distribution difficult. Although the use of decoupling capacitors can help reduce such noise, building capacitors into a substrate filled with high density visa tends to be difficult and costly.
SUMMARY OF THE INVENTION
The present invention is directed to utilizing the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling capacitors and planar transformers.
Various objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the invention, along with the accompanying drawings in which like numerals represent like components.
REFERENCES:
patent: 4221047 (1980-09-01), Narken
patent: 4814857 (1989-03-01), Werbizky
patent: 5625222 (1997-04-01), Yoneda
patent: 5866943 (1999-02-01), Mertol
patent: 5877043 (1999-03-01), Alcoe
patent: 5895967 (1999-04-01), Stearns
patent: 5973389 (1999-10-01), Culnane
patent: 6084777 (2000-07-01), Kalidas
patent: 6111313 (2000-08-01), Kutlu
patent: 6140707 (2000-10-01), Plepys
patent: 6208022 (2001-03-01), Tamura
patent: 404343465 (1992-11-01), None
Chaudhuri Olik
Fish Robert D.
Ha Nathan W.
Honeywell International , Inc.
Rutan & Tucker LLP
LandOfFree
Power conditioning substrate stiffener does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power conditioning substrate stiffener, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power conditioning substrate stiffener will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3066038