Power component assembly for mechatronic integration of...

Details Power component assembly for mechatronic integration of... Power component assembly for mechatronic integration of...

2005-03-15

2005-03-15

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C257S712000, C257S722000, C174S252000

Reexamination Certificate

active

06867972

ABSTRACT:
A power component assembly for mechatronic integration of power components is disclosed. The assembly includes a circuit board on which a plurality of bare power components is arranged. At least one cooling element is connected to a pressure-mounting frame that holds the power components in thermal contact with the cooling element(s). Heat generated by the power components is thereby dissipated by the cooling element(s).

REFERENCES:
patent: 6055158 (2000-04-01), Pavlovic
patent: 6084178 (2000-07-01), Cromwell
patent: 6185100 (2001-02-01), Bentz et al.
patent: 6188576 (2001-02-01), Ali et al.
patent: 6459582 (2002-10-01), Ali et al.
patent: 6697263 (2004-02-01), Szu
patent: 20040042178 (2004-03-01), Gektin et al.

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