Power chip package

Details Power chip package Power chip package

1983-01-03

1985-08-27

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 81, 357 68, 357 74, 174 16HS, H01L 2308, H01L 2304, H01L 2348, H01L 2312

Patent

active

045381704

ABSTRACT:
A heat-generating power semiconductor chip is mounted in a package to permit testing or use of the chip before or after mounting of the package to a heat spreader plate. A plurality of sheet metal leads are attached to a dielectric substrate, such as beryllia. The leads are patterned in mirror image fashion to a plurality of terminals on one side of the power chip. In one form, a further sheet metal lead is attached to a further dielectric substrate and is adapted to abut a terminal on the other side of the power chip. In another form, heat transfer structure is provided for transferring heat between the pair of dielectric substrates, thereby enabling heat to be removed from both sides of the power chip.

REFERENCES:
patent: Re29325 (1977-07-01), Hargis
patent: 3025436 (1962-03-01), Staller
patent: 3196325 (1965-07-01), Swartz
patent: 3377206 (1968-04-01), Hanlein et al.
patent: 3566212 (1971-02-01), Marx
patent: 3611059 (1971-10-01), Carley
patent: 3649881 (1972-03-01), Chang et al.
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3842189 (1974-10-01), Southgate
patent: 3994430 (1916-11-01), Cusano et al.
patent: 4067041 (1978-01-01), Hutson
"Technology Update", EDN Magazine (May 27, 1981), pp. 49-56, 58, 66-68, 70, 72 and 74.
"The General Electric Hi-Line.TM. Power Module Concept" by D. R. Grafham and E. I. Carroll of the General Electric Co., Application Engineering-Paris International General Electric Brochure 80.02 (9/80).

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