Power capacitor

Electrical connectors – With circuit component or comprising connector which fully... – Termination circuit

Reexamination Certificate

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Reexamination Certificate

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06409545

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the field of capacitor banks and more particularly to an arrangement and method for connecting capacitor components to the capacitor bank boards. The connection is effected such that the capacitor components are securely held in place in an secure and modular manner while electrical connection between the components and board is maintained.
2. Description of Related Art
Condenser banks and capacitors therefor are well known in the art as exemplified by European patent EP 0 450 122 B1. Herein, the capacitors are affixed to a printed circuit board via connecting bolts and nuts and/or solder. The development of these power condensers is directed towards improved inverters and semiconductor valves. Additional applications for power condensers is with IGBT (insulated gate bipolar transistor) semiconductors. The capacity of the capacitor banks ranges from about 100 kilowatts to upwards of 6 megawatts. An additional application for the banks is with rectifiers wherein some success has been achieved through reduction of capacitor component size and lowering of parasitic inductance therebetween. However, the related art applications do not have the modular compactness sometimes desired in the industry, nor the possibility of plugging modular capacitor components onto the capacitor bank boards where such elements are securely held in place and power flows via the connection between component and board. Such possibility simplifies the connection, as no solder and/or nuts and bolts are necessary, thereby reducing engineering and manufacturing costs while increasing design possibilities.
BRIEF SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide an improved modular arrangement for connecting capacitor components, such as condenser batteries, to boards forming capacitor banks. It is a further object to provide an arrangement which can be implemented so as to enable mass production at reasonable engineering effort and expense and with maximally replicable component characteristics. It is a further object that the capacitor components are snap fitted and/or plugged into the board. It is a further object that the connection be sufficient to facilitate electrical communication of various power levels, as may seem fit to the ordinary designer, between component and board. It is a further object to reduce parasitic inductance and lower resistance in the connection of the components and board. (spread out contacts)
With the foregoing and other objects in view there is provided, in accordance with the invention, an arrangement for attaching at least one capacitor component and a printed circuit board, said arrangement comprising at least one blade contact for conducting electrical power, said blade contact formed by an elevated conductor end of a conductor accommodated by said board; and a number of connection members for effecting electrical communication with said blade contacts, said members formed within said at least one capacitor component and having a housing comprising a cavity and opposing contact leads for receiving said blade contacts therebetween such that said blade contacts are securely held and electrical contact between said blade contacts and said opposing contact leads is maintained.
In addition, the present invention includes a method of attaching a capacitor component to a board comprising the step of plugging a blade connector formed from an elevated conductor end of a conductor housed within said board, into a pair of opposing contact leads within a receiving member which is further formed within said capacitor component, such that said blade connector is snapped fitted between said contact leads and electrical contact is established between said blade connector and receiving member.
The invention is explained in greater detail below by reference to exemplary embodiments shown in the drawings.


REFERENCES:
patent: 3864004 (1975-02-01), Friend
patent: 5038252 (1991-08-01), Johnson
patent: 5624269 (1997-04-01), Kanamori
patent: 5827094 (1998-10-01), Aizawa et al.
patent: 5921820 (1999-07-01), Dijkstra
patent: 0450122 (1991-10-01), None

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