Power and signal distribution in electronic packaging

Details Power and signal distribution in electronic packaging Power and signal distribution in electronic packaging

1992-10-02

1994-02-08

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 361794, H01R 909

Patent

active

052850188

ABSTRACT:
A controlled impedance power and distribution network wherein -x- and -y- direction planes of interpositioned power and signal conductors with a dielectric layer between planes and separating each plane from a ground plane are assembled. The network provides the ability to distribute many power levels with all power and signal conductors electrically referenced to ground along their length and each signal conductor also electrically referenced to its respective power level along its length. The network is of particular advantage in the TFM technology in distributing multiple power levels with fewer layers.

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patent: 4710854 (1987-12-01), Yamada et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4847732 (1989-07-01), Stopper et al.
patent: 4855537 (1989-08-01), Nakai et al.
patent: 4859806 (1989-08-01), Smith
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 5003273 (1991-03-01), Oppenberg
patent: 5028983 (1991-07-01), Bickford et al.

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