Power and ground ring snake pattern to prevent delamination...

Details Power and ground ring snake pattern to prevent delamination... Power and ground ring snake pattern to prevent delamination...

2008-04-15

2009-02-10

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S770000, C361S775000, C361S777000, C361S782000

Reexamination Certificate

active

07489519

ABSTRACT:
An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend substantially parallel to the integrated circuit, interleaved with second portions that extend substantially toward the integrated circuit, each second portion having an end contiguous with a first portion and another end contiguous with a another first portion. A first set of wires connects the first bus with a first plurality of nodes on the integrated circuit. The package also includes a second bus and a second set of wires.

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