Power and ground plane structure for chip carrier

Details Power and ground plane structure for chip carrier Power and ground plane structure for chip carrier

1981-08-14

1983-11-22

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 70, 357 68, 29576R, 29589, 428620, H01L 3902, H01L 2348, H01L 2944

Patent

active

044172664

ABSTRACT:
A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected in a bus structure around the chip at the center of the chip carrier with the chip being secured to the chip carrier with the bus structure over a thermal pad formed within the bus structure. A decoupling capacitor is located in close proximity to the chip on the substrate to assure low reaction due to switching.

REFERENCES:
patent: 3648122 (1972-03-01), Berglund et al.
patent: 4366342 (1982-12-01), Breedlove

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